| PART |
Description |
Maker |
| BIR-BM18E4G-2 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| BIR-BO13E4G-2 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
Bright LED Electronics Corp.
|
| BIR-BM1331 |
END-LOOK PACKAGE LIGHT EMITTING DIODE
|
BRIGHT LED ELECTRONICS CORP
|
| BPT-BP0934 |
END- LOOK PACKAGE PHOTOTRANSISTOR
|
BRIGHT LED ELECTRONICS CORP
|
| T7024-TRS T7024 T7024-PGP T7024-PGQ T7024-TRQ |
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT.
BluetoothISM 2.4-GHz Front- End IC
Bluetooth?ISM 2.4-GHz Front- End IC
Bluetooth⑩/ISM 2.4-GHz Front- End IC
Bluetooth/ISM 2.4-GHz Front- End IC
|
Atmel Corp.
ATMEL[ATMEL Corporation]
|
| BPD-BQBA34 |
END- LOOK PACKAGE PIN PHOTO DIODE
|
BRIGHT LED ELECTRONICS CORP
|
| 2SD1048 |
Ultrasmall package allows miniaturization in end products.
|
TY Semiconductor Co., Ltd
|
| TLYH180P TLYH180PVW |
LED Lamp InGaAlP Yellow Light Emission
TOSHIBA LED Lamp InGaAP Yellow Light Emission
TOSHIBA LED Lamp InGaAГP Yellow Light Emission
T-1 3/4 SINGLE COLOR LED, HIGH INTENSITY YELLOW, 5 mm PLASTIC PACKAGE-2
|
TOSHIBA[Toshiba Semiconductor]
Newhaven Display International, Inc.
|
| SON MICROLEADFRAME DFN |
Saw MLF PEL (Plated End Lead) Package
|
Amkor Technology
|
| OP270 OP272 |
Infrared Light Emitting Diode in SMD Plastic Package
|
Optek Technology
OPTEK Technologies
|
| HP333 |
Double-end type high-sensitivity photo diode mounted in a compact clear package
|
Kodenshi Corp
KODENSHI KOREA CORP.
|
